Deposition of copper thin films by plasma enhanced pulsed chemical vapor deposition for metallization of carbon fiber reinforced plastics
- 1 December 2016
- journal article
- Published by Elsevier in Surface and Coatings Technology
- Vol. 307, 1059-1064
Abstract
No abstract availableKeywords
Funding Information
- NSFC (11375031)
- Importation and Development of High-Caliber Talents Project of Beijing Municipal Institutions (CIT&TCD201404130, KM201510015002)
- Natural Science Foundation of Beijing Municipality (4162024)
- State Key Laboratory of Electrical Insulation and Power Equipment (EIPE15208)
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