Heat transfer and pressure drop characteristics of arrays of rectangular modules encountered in electronic equipment
Authors:
- E.M. SparrowESE.M. Sparrow
- J.E. NiethammerJNJ.E. Niethammer
- A. ChabokiACA. Chaboki
- 1 July 1982
- journal article
- Published by Elsevier in International Journal of Heat and Mass Transfer
- Vol. 25 (7) , 961-973