Transition from rectangular waveguide to empty substrate integrated gap waveguide

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Abstract
Empty substrate integrated waveguide (ESIW) is a hollow SIW with its inner dielectric removed to achieve a reduced insertion loss. One of the drawbacks is the top and bottom covers need to be soldered to the middle substrate. Gap waveguide (GW) technology solves the contact issue utilising contactless electromagnetic band‐gap (EBG) structures. Therefore, empty substrate integrated GW (ESIGW) is a transmission line having both advantages of ESIW and GW. In this Letter, a wideband transition from rectangular waveguide (RW) to ESIGW is presented. RW is firstly matched to reduced‐height RW using E ‐plane stepped waveguides. Then, a short substrate integrated GW (SIGW) section is introduced between the reduced‐height RW and the ESIGW. This section not only serves as an impedance matching component, it also connects the two sides of the ESIGW and maintains the integrity of the substrate. To broaden the bandwidth of the transition, a triangular dielectric is added at the end of the ESIGW. A Ka‐band back‐to‐back prototype of the transition is designed and fabricated. In addition, TRL calibration is used to measure the transmission performance of the ESIGW. The measured results show that the transition works well over the entire Ka‐band.
Funding Information
  • Fundamental Research Funds for the Central Universities (JB180506)

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