An experimental investigation of silicon wafer thinning by sequentially using constant-pressure diamond grinding and fixed-abrasive chemical mechanical polishing
Authors:
- Gengzhuo LiGLGengzhuo Li
- Chen XiaoCXChen Xiao
- Shibo ZhangSZShibo Zhang
- Ruoyu SunRSRuoyu Sun
- Yongbo WuYWYongbo Wu
- 1 March 2022
- journal article
- research article
- Published by Elsevier in Journal of Materials Processing Technology
- Vol. 301
Abstract
No abstract availableKeywords
Funding Information
- Shenzhen Knowledge Innovation Program (JCYJ20180504165815601)
- National Natural Science Foundation of China (51975269)
- Science, Technology and Innovation Commission of Shenzhen Municipality (KQTD20170810110250357)
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