Silicon carbide based dielectric composites in bilayer sidewall barrier for Cu∕porous ultralow-k interconnects
Authors:
- 15 August 2005
- journal article
- Published by American Vacuum Society in Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena
- Vol. 23 (5) , 1866-1872
Abstract
No abstract availableThis publication has 11 references indexed in Scilit:
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