Making a Complete Mess and Getting Away With It: Traveling Salesperson Problems With Circle Placement Variants
- 19 August 2024
- journal article
- research article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Robotics and Automation Letters
- Vol. 9 (10) , 8555-8562
Abstract
This letter explores a variation of the Traveling Salesperson Problem, where the agent places a circular obstacle next to each node once it visits it. Referred to as the Traveling Salesperson Problem with Circle Placement (TSP-CP), the aim is to maximize the obstacle radius for which a valid closed tour exists and then minimize the tour cost. The TSP-CP finds relevance in various real-world applications, such as harvesting, quarrying, and open-pit mining. We propose several novel solvers to address the TSP-CP, its variant tailored for Dubins vehicles, and a crucial subproblem known as the Traveling Salesperson Problem on self-deleting graphs (TSP-SD). Our extensive experimental results show that the proposed solvers outperform the current state-of-the-art on related problems in solution quality.Keywords
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Funding Information
- European Commission
- ROBOPROX (CZ.02.01.01/00/22_008/0004590)
- Grant Agency of the Czech Technical University in Prague (SGS23/122/OHK3/2T/13)
- UK Research and Innovation (10042096)
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