Low crosstalk modular flip-chip architecture for coupled superconducting qubits

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Abstract
We present a flip-chip architecture for an array of coupled superconducting qubits, in which circuit components reside inside individual microwave enclosures. In contrast to other flip-chip approaches, the qubit chips in our architecture are electrically floating, which guarantees a simple, fully modular assembly of capacitively coupled circuit components, such as qubit, control, and coupling structures as well as reduced crosstalk between the components. We validate the concept with a chain of three nearest neighbor coupled generalized flux qubits in which the center qubit acts as a frequency-tunable coupler. Using this coupler, we demonstrate a transverse coupling on/off ratio≈50, zz−crosstalk ≈0.7 kHz between resonant qubits and isolation between the qubit enclosures>60 dB.
Funding Information
  • European Commission (AVaQus, GA 899561)
  • Bundesministerium für Forschung, Technologie und Raumfahrt (GEQ- COS (FKZ: 13N15683))
  • Deutsche Forschungsgemeinschaft (450396347 (GeHoldeQED))
  • 'la Caixa' Foundation ("la Caixa" Foundation (ID 100010434) via fellowship code LCF/BQ/DR22/11950032.)

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