Microstructural evolution, microhardness and thermal stability of HPT-processed Cu
Authors:
- 1 October 2000
- journal article
- Published by Elsevier in Materials Science and Engineering: A
- Vol. 290 (1-2) , 128-138
Abstract
No abstract availableKeywords
This publication has 64 references indexed in Scilit:
- Thermal stability of submicron grained copper and nickelMaterials Science and Engineering: A, 1997
- Materials processing by simple shearMaterials Science and Engineering: A, 1995
- Processing and mechanical behavior of nanocrystalline FeNanostructured Materials, 1995
- Calorimetric analysis of the grain growth in nanocrystalline copper samplesNanostructured Materials, 1993
- An investigation of ductility and microstructural evolution in an Al−3% Mg alloy with submicron grain sizeJournal of Materials Research, 1993
- On the hardening and softening of nanocrystalline materialsNanostructured Materials, 1993
- Materials with ultrafine microstructures: Retrospectives and perspectivesNanostructured Materials, 1992
- Microhardness and fracture properties of nanocrystalline NiP alloyScripta Metallurgica et Materialia, 1990
- On the validity of the hall-petch relationship in nanocrystalline materialsScripta Metallurgica, 1989
- Nanocrystalline materialsMaterials Science and Engineering: A, 1989