Finite element analysis of a three‐dimensional package
Authors:
- Zhaowei ZhongZZZhaowei Zhong
- Peng Kiong YipPYPeng Kiong Yip
- 1 April 2003
- journal article
- Published by Emerald Publishing in Soldering & Surface Mount Technology
- Vol. 15 (1) , 21-25
Abstract
A three‐dimensional (3D) package consisting of a stack of three silicon chips was conceptually designed. A finite element simulation of this 3D package was conducted in order to compare the fatigue lives of the solder joints with those in a typical single flip chip package when subjected to a cyclic thermal loading. It was found that the proposed design of the 3D package was feasible in terms of its mechanical deformation response to the thermal cycle.Keywords
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