The corrosion of copper as a tool in the investigation of the reaction kinetics

This publication has 19 references indexed in Scilit:

• The deposition of copper
  Journal of Electroanalytical Chemistry and Interfacial Electrochemistry, 1975
• Investigations of the kinetics of Cu/Cu2+ electrode using the galvanostatic double pulse method
  Electrochimica Acta, 1974
• Regularities of low-valency intermediate accumulation during a step-wise electrode process
  Electrochimica Acta, 1972
• Copper electrocrystallization mechanism according to morphological data and impedance measurements
  Electrochimica Acta, 1971
• Cu(II)/Cu exchange reaction in sulphate electrolyte
  Transactions of the Faraday Society, 1971
• Anion Effects in Copper Deposition
  Journal of the Electrochemical Society, 1970
• Existence et détection de l'espèce intermédiaire dans un système électrochimique à deux électrons
  Electrochimica Acta, 1968
• The rate-determining step in the electro-deposition of copper on copper from aqueous cupric sulphate solutions
  Electrochimica Acta, 1965
• Radiotracer studies on the Cu/Cuaq2+ electrode
  Electrochimica Acta, 1963
• On the calculation of potential energy profile diagrams for processes in electrolytic metal deposition
  Electrochimica Acta, 1961