Wireless communication in a flip-chip package using integrated antennas on silicon substrates
Authors:
- 24 January 2005
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Electron Device Letters
- Vol. 26 (2) , 115-117
Abstract
An intrachip wireless interconnect using integrated antennas is demonstrated in a flip-chip ball grid array package. The wireless interconnect consists of a transmitter-receiver pair, which is fabricated in a 0.18-μm CMOS process. A 15-GHz signal is generated and broadcasted across the integrated circuit. The signal is picked up by a receiver 4 mm away on the same integrated circuit and frequency divided by eight to produce a 1.875-GHz local clock signal. The interconnection is also demonstrated between a transmitting antenna and a packaged receiver 40 cm away from the transmitting antenna. Demonstration of intrachip wireless interconnects in a package has been considered the ultimate test for this technology.Keywords
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