Microwave Characterization of Copper-Clad Dielectric Laminate Substrates
Author:
- Yoshio KobayashiYKYoshio Kobayashi
- 1 December 2007
- journal article
- Published by Institute of Electronics, Information and Communications Engineers (IEICE) in IEICE Transactions on Electronics
- Vol. E90-C (12) , 2178-2184