Development of a directly bonded aluminum/alumina power electronic substrate
Authors:
- Xiao-Shan NingXNXiao-Shan Ning
- Yuanbo LinYLYuanbo Lin
- Wei XuWXWei Xu
- Rong PengRPRong Peng
- Heping ZhouHZHeping Zhou
- Kexin ChenKCKexin Chen
- 1 May 2003
- journal article
- Published by Elsevier in Materials Science and Engineering: B
- Vol. 99 (1-3) , 479-482
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- Manufacture and Analyses of Ceramic/Aluminum Laminated CompositesKey Engineering Materials, 2002