Experimental method and FE simulation model for evaluation of wafer probing parameters
Authors:
- D.S. LiuDLD.S. Liu
- M.K. ShihMSM.K. Shih
- 1 September 2006
- journal article
- Published by Elsevier in Microelectronics Journal
- Vol. 37 (9) , 871-883
Abstract
No abstract availableKeywords
Funding Information
- National Science Council (NSC94-2212-E-194-010, NSC94-2212-E-194-013)
This publication has 6 references indexed in Scilit:
- Development of low-force copper contact processes2004
- Probe contact resistance variations during elevated temperature wafer test2003
- Impact of wafer probe damage on flip chip yields and reliability2002
- Effects of probe damage on wire bond integrity2002
- Array sockets and connectors using MicroSpring/sup TM/ technology2002
- Highly reliable probe card for wafer testing2002