High-Precision Low-Damage Grinding of Polycrystalline SiC
Authors:
- L. YinLYL. Yin
- E.Y.J. VancoilleEVE.Y.J. Vancoille
- Y.C. LiuYLY.C. Liu
- H. HuangHHH. Huang
- K. RameshKRK. Ramesh
- 1 April 2003
- journal article
- Published by Trans Tech Publications, Ltd. in Key Engineering Materials
- Vol. 238-239, 59-64
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- Grinding Mechanisms and Strength Degradation for CeramicsJournal of Engineering for Industry, 1989