Understanding the mechanism of heat stress tolerance caused by high trehalose accumulation in Saccharomyces cerevisiae using DNA microarray
Authors:
- Takashi HirasawaTHTakashi Hirasawa
- Chikara FurusawaCFChikara Furusawa
- Katsunori YoshikawaKYKatsunori Yoshikawa
- Hiroshi ShimizuHSHiroshi Shimizu
- 1 April 2012
- journal article
- research article
- Published by Elsevier in Journal of Bioscience and Bioengineering
- Vol. 113 (4) , 526-528
Abstract
No abstract availableKeywords
Funding Information
- Japan Society for the Promotion of Science (20700270, 21780071)
- Ministry of Education, Culture, Sports, Science and Technology
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