Convective heat transfer from simulated air-cooled printed-circuit board assembly on horizontal or vertical orientation
Authors:
- 1 January 1998
- journal article
- Published by Elsevier in International Communications in Heat and Mass Transfer
- Vol. 25 (1) , 67-80
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
- Laminar Heat Transfer Between a Series of Parallel Plates With Surface-Mounted Discrete Heat SourcesJournal of Electronic Packaging, 1995
- Forced convective air-cooling of simulated printed-circuit boardsApplied Energy, 1993
- LAMINAR BUOYANCY-ENHANCED CONVECTION FLOWS ON REPEATED BLOCKS WITH ASYMMETRIC HEATINGNumerical Heat Transfer, Part A: Applications, 1992
- Convection Heat Transfer in Electronic Equipment CoolingJournal of Heat Transfer, 1988
- Forced Convection Cooling Across Rectangular BlocksJournal of Heat Transfer, 1987
- Fully Developed Flow and Heat Transfer in Ducts Having Streamwise-Periodic Variations of Cross-Sectional AreaJournal of Heat Transfer, 1977