Modeling of high power light-emitting diode package integrated with micro-thermoelectric cooler under various interfacial and size effects
Authors:
- Dongfang SunDSDongfang Sun
- Guanyu LiuGLGuanyu Liu
- Limei ShenLimei Shen
- Huanxin ChenHCHuanxin Chen
- Yu YaoYYYu Yao
- Shiping JinSJShiping Jin
- 1 January 2019
- journal article
- research article
- Published by Elsevier in Energy Conversion and Management
- Vol. 179, 81-90
Abstract
No abstract availableKeywords
Funding Information
- Fundamental Research Funds for the Central Universities (2016YXMS048, 51506060)
- National Natural Science Foundation of China (2016YXMS048, 51506060)
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