Preparation of Porous Material by Replacing Microstructure of Anodic Alumina Film with Metal

Authors:

Abstract
A new type of preparing method of submicron scale porous conducting materials was demonstrated. A microporous structure of anodic alumina film was replaced with metal by using a two step molding technique. The procedure and condition of the fabrication process of the porous film was described.

This publication has 1 reference indexed in Scilit: