Advanced multilayer metallization schemes with copper as interconnection metal
Authors:
- S.P. MurarkaSMS.P. Murarka
- R.J. GutmannRGR.J. Gutmann
- A.E. KaloyerosAKA.E. Kaloyeros
- W.A. LanfordWLW.A. Lanford
- 1 December 1993
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 236 (1-2) , 257-266
Abstract
No abstract availableThis publication has 16 references indexed in Scilit:
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