On the influence of small quantities of Bi and Sb on the evolution of microstructure during swaging and heat treatments in copper

This publication has 29 references indexed in Scilit:

• Chemistry and bonding changes associated with the segregation of Bi to grain boundaries in Cu
  Acta Materialia, 1998
• The Solidus Line of the Cu-Bi Phase Diagram
  Journal of Phase Equilibria and Diffusion, 1997
• Relationship between misorientation and bismuth induced embrittlement of [001] tilt boundary in copper bicrystal
  Scripta Metallurgica et Materialia, 1995
• Atomic structure of a grain boundary in a metallic alloy: Combined electron microscope and theoretical study
  Physical Review Letters, 1991
• High temperature intergranular crack growth processes in copper and copper with 1 wt% antimony
  Acta Metallurgica, 1985
• An analytical electron microscope study of the kinetics of the Equilibrium Segregation of Bismuth in Copper
  Metallurgical Transactions A, 1984
• Observations of fracture surface chemistry on Cu-0.5 At. % Sb bicrystals
  Scripta Metallurgica, 1982
• A STEM/X‐ray microanalytical study of the equilibrium segregation of bismuth in copper
  Journal of Microscopy, 1981
• Grain boundary faceting in Cu-Bi alloys
  Acta Metallurgica, 1979
• The segregation of bismuth to grain boundaries in copper-bismuth alloys
  Acta Metallurgica, 1973