Atomistic and continuum studies of crack-like diffusion wedges and associated dislocation mechanisms in thin films on substrates
- 1 November 2003
- journal article
- Published by Elsevier in Journal of the Mechanics and Physics of Solids
- Vol. 51 (11-12) , 2105-2125
Abstract
No abstract availableKeywords
This publication has 31 references indexed in Scilit:
- Local Plasticity of Al Thin Films as Revealed by X-Ray MicrodiffractionPhysical Review Letters, 2003
- Structural stability and lattice defects in copper:Ab initio, tight-binding, and embedded-atom calculationsPhysical Review B, 2001
- A New Type of Dislocation Mechanism in Ultrathin Copper FilmsMRS Proceedings, 2001
- Self-diffusion in high-angle fcc metal grain boundaries by molecular dynamics simulationPhilosophical Magazine A, 1999
- Mechanism-based strain gradient plasticity— I. TheoryJournal of the Mechanics and Physics of Solids, 1999
- Continuous thermodynamic-equilibriumglass transition in high-energy grain boundaries?Philosophical Magazine Letters, 1997
- Nucleation of dislocations from crack tips under mixed modes of loading: Implications for brittle against ductile behaviour of crystalsPhilosophical Magazine A, 1995
- Stress development and relaxation in copper films during thermal cyclingJournal of Materials Research, 1993
- A computer simulation method for the calculation of equilibrium constants for the formation of physical clusters of molecules: Application to small water clustersThe Journal of Chemical Physics, 1982
- Crack Point Stress Singularities at a Bi-Material InterfaceJournal of Applied Mechanics, 1963