Printing solder droplets for micro devices packages using pneumatic drop-on-demand (DOD) technique
Authors:
- Jun LuoJLJun Luo
- Le-Hua QiLQLe-Hua Qi
- Song-Yi ZhongSZSong-Yi Zhong
- Ji-Ming ZhouJZJi-Ming Zhou
- He-Jun LiHLHe-Jun Li
- 1 October 2012
- journal article
- Published by Elsevier in Journal of Materials Processing Technology
- Vol. 212 (10) , 2066-2073
Abstract
No abstract availableKeywords
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