Integrated CALPHAD–Machine Learning–Experimental Framework for Thermodynamic Design of Lead-Free Bi–In–Sn Solder Alloys
Authors:
- Shanker KumarSKShanker Kumar
- Mukesh Raushan KumarMKMukesh Raushan Kumar
- 14 May 2026
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 55 (7) , 6382-6399
Abstract
No abstract availableThis publication has 28 references indexed in Scilit:
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