An Electrically Conducting Water‐based Reversible Adhesive

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Abstract
An electrically conducting reversible adhesive with conductivity up to 2.9 × 10 5 S m −1 and lap shear strength of up to 1.5 MPa is presented. The reversibility of the glue enables debonding of surfaces on exposure to alkaline media. The adhesive comprises polyelectrolyte‐stabilized nanoparticles synthesized by emulsion polymerization and silver nanoparticles as conductive filler. The conductivity of these formulations is comparable to, or exceeds, that of commercially available conductive adhesives, while their mechanical performance is consistent with typical water‐based adhesive systems. Adhesion is reversed by immersing the bonded joints at pH 14. By heating to 85°C and stirring the solution (500 rpm), the debonding time can be reduced to ∼30 min or less. Separation can also be achieved at 85°C at pH 7. Short debonding times can also be achieved at room temperature by using acetone, a recognized green solvent. This electronically conducting reversible adhesive therefore presents a great opportunity to improve the reuse or recycling of electronic components.
Funding Information
  • Engineering and Physical Sciences Research Council (EP/Y008316/1)
  • Royal Commission for Jubail and Yanbu

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