An Improved Thermal Network Model of the IGBT Module for Wind Power Converters Considering the Effects of Base-Plate Solder Fatigue

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Abstract
This paper presents an improved thermal network model of insulated-gate bipolar transistor (IGBT) module, which considers the effects of base-plate solder fatigue on the junction temperature of the said module used in wind power converters. First, the coupling thermal structure 3-D finite-element model of the IGBT module is established based on the structure and material parameters of the module used in the wind power converters of a doubly fed induction generator. The junction temperature of the module is investigated at different thermal desquamating degrees of the base-plate solder. Second, the thermal resistance parameters are determined at different desquamating degrees, and the improved thermal network model that considers the effects of the base-plate solder fatigue is established. Finally, the IGBT junction temperature results through the improved thermal network, and the 3-D FEM models are compared.
Funding Information
  • National Natural Science Foundation of China (51377184)
  • International Science and Technology cooperation program of China (2013DFG61520)
  • Fundamental Research Funds for the Central Universities (106112016CDJZR158802)
  • Chongqing Graduate Student Research Innovation Project (CYB16020)
  • Integration and Demonstration Program of Chongqing (CSTC2013JCSF70003)

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