Thermo Optical Properties of 3D Photonic Wire Bonding Connecting Silicon Nitride Waveguides
- 25 April 2022
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 908-911
Abstract
This paper investigates the thermo-optical (TO) effect of misaligned polymer wire bonds (PWB) connecting planar silicon nitride waveguides. To characterize the fabricated devices, we measured the optical transmission through PWBs by changing the chip temperature in the range from 30°C to 80°C. We used an experimental setup, which included a tunable laser source in the 1510-1620 nm range and a changeable temperature stage. By gradually changing the temperature of the sample, we measured the transmission parameter through the reference arm and the arm with PWB. We found that the TO coefficient equals 837 pm/°C, respectively, with the change resonance wavelength. The results can be used to design complex optical interconnections inside and between chip and show the thermal stability of such interconnection.Keywords
Funding Information
- Russian Foundation for Basic Research
This publication has 11 references indexed in Scilit:
- Hybrid integrated InP-Si3N4 diode laser with a 40-Hz intrinsic linewidthOptics Express, 2020
- Three-dimensional polymer wire bonds on a chip: morphology and functionalityJournal of Physics D: Applied Physics, 2020
- Hybrid Integrated Semiconductor Lasers with Silicon Nitride Feedback CircuitsPhotonics, 2019
- Label-free biosensing using a microring resonator integrated with poly-(dimethylsiloxane) microfluidic channelsReview of Scientific Instruments, 2019
- A Versatile Silicon-Silicon Nitride Photonics Platform for Enhanced Functionalities and ApplicationsApplied Sciences, 2019
- Silicon Nitride in Silicon PhotonicsProceedings of the IEEE, 2018
- Quantum photonic integrated circuits based on tunable dots and tunable cavitiesAPL Photonics, 2018
- Hybrid integration of silicon photonics circuits and InP lasers by photonic wire bondingOptica, 2018
- Advanced InP Photonic Integrated Circuits for Communication and SensingIEEE Journal of Selected Topics in Quantum Electronics, 2018
- Meeting the Electrical, Optical, and Thermal Design Challenges of Photonic-PackagingIEEE Journal of Selected Topics in Quantum Electronics, 2016