The Role of Si and Cu Alloying Elements on the Dendritic Growth and Microhardness in Horizontally Solidified Binary and Multicomponent Aluminum-Based Alloys
Authors:
- 10 January 2017
- journal article
- research article
- Published by Springer Nature in Metallurgical and Materials Transactions A
- Vol. 48 (3) , 1163-1175
Abstract
No abstract availableKeywords
This publication has 43 references indexed in Scilit:
- The Growth of Secondary Dendritic Arms in Directionally Solidified Al-Si-Cu Alloys: A Comparative Study with Binary Al-Si AlloysApplied Mechanics and Materials, 2015
- Microstructural Development in a Ternary Al-Cu-Si Alloy during Transient SolidificationMaterials Science Forum, 2010
- Modeling and experimental analysis of macrosegregation during transient solidification of a ternary Al–6wt%Cu–1wt%Si alloyPhilosophical Magazine Letters, 2009
- The columnar to equiaxed transition during the horizontal directional solidification of Sn–Pb alloysJournal of Alloys and Compounds, 2009
- Copper content and cooling rate effects over second phase particles behavior in industrial aluminum–silicon alloy 319Materials & Design (1980-2015), 2007
- Macrostructural and microstructural development in Al–Si alloys directionally solidified under unsteady-state conditionsJournal of Alloys and Compounds, 2004
- Heat flow parameters affecting dendrite spacings during unsteady-state solidification of Sn-Pb and Al-Cu alloysMetallurgical and Materials Transactions A, 2003
- On dendritic solidification of multicomponent alloys with unequal liquid diffusion coefficientsActa Materialia, 1999
- Prediction of dendrite arm spacings in unsteady-and steady-state heat flow of unidirectionally solidified binary alloysMetallurgical and Materials Transactions B, 1997
- A simple model for dendrite arm coarsening during solidificationMaterials Science and Engineering, 1985