Materials Discovery and Properties Prediction in Thermal Transport via Materials Informatics: A Mini Review
Authors:
- Xiao WanXWXiao Wan
- Wentao FengWFWentao Feng
- Yunpeng WangYWYunpeng Wang
- Chengcheng DengCDChengcheng Deng
- Nuo YangNYNuo Yang
- 15 May 2019
- journal article
- research article
- Published by American Chemical Society (ACS) in Nano Letters
- Vol. 19 (6) , 3387-3395
Abstract
There has been increasing demand for materials with functional thermal properties, but traditional experiments and simulations are high-cost and time-consuming. The emerging discipline, materials informatics, is an effective approach that can accelerate materials development by combining material science and big data techniques. Recently, materials informatics has been successfully applied to designing thermal materials, such as thermal interface materials for heat-dissipation, thermoelectric materials for power generation, etc. This mini-review summarizes the research progress associated with studies regarding the prediction and discovery of materials with desirable thermal transport properties by using materials informatics. Based on the review of past research, perspectives are discussed and future directions for studying functional thermal materials by materials informatics are given.Keywords
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Funding Information
- Ministry of Education of the People's Republic of China (2019kfyRCPY045)
- Natural Science Foundation of Hubei Province (2017CFA046)
- National Natural Science Foundation of China (51576076, 51711540031, 51606072)
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