Electro-thermal simulation of bond wires in power modules for realistic mission profiles
Authors:
- 1 December 2017
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 535-543
Abstract
For the successful electrification of global transportation, the reliability of power electronic modules is of major importance. Today, one of the main reasons for module failure is the thermo-mechanically induced fatigue of bond wires as a result of strong load variations. A multitude of studies have been conducted to analyze the operational stress of bond wires based on thermal simulations using simple repetitive load patterns. This paper proposes a compact electro-thermal model for detailed time-efficient simulations of the thermal stress within bond wires. It incorporates the impact of parasitic electromagnetic coupling effects for an accurate loss determination over a wide frequency range. Finally, the bond wire model is embedded into a system simulation of the drive train of an electric vehicle. This allows to determine the realistic temperature distribution along the bond wires over time for specific mission profiles.Keywords
This publication has 19 references indexed in Scilit:
- Circuit Oriented Electromagnetic Modeling Using the Peec Techniques2017
- Spatial electro-thermal modeling and simulation of power electronic modules2017
- Model order reduction suitable for online linear parameter-varying thermal models of electric motors2016
- 3-D Thermal Component Model for Electrothermal Analysis of Multichip Power Modules With Experimental ValidationIEEE Transactions on Power Electronics, 2014
- Electrical-thermal characterization of wires in packages2014
- Electro-thermal-mechanical modeling of wire bonding failures in IGBT2013
- Exact closed-form formula for partial mutual inductances of rectangular conductorsIEEE Transactions on Circuits and Systems I: Regular Papers, 2003
- Principal component analysis in linear systems: Controllability, observability, and model reductionIEEE Transactions on Automatic Control, 1981
- Inductance Calculations in a Complex Integrated Circuit EnvironmentIBM Journal of Research and Development, 1972
- Exact inductance equations for rectangular conductors with applications to more complicated geometriesJournal of Research of the National Bureau of Standards, Section C: Engineering and Instrumentation, 1965