A mm-Sized Implantable Medical Device (IMD) With Ultrasonic Power Transfer and a Hybrid Bi-Directional Data Link

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Abstract
A first proof-of-concept mm-sized implantable device using ultrasonic power transfer and a hybrid bi-directional data communication link is presented. Ultrasonic power transfer enables miniaturization of the implant and operation deep inside the body, while still achieving safe and high power levels (100 μW to a few mWs) required for most implant applications. The current implant prototype measures 4 mm ×7.8 mm and is comprised of a piezoelectric receiver, an IC designed in 65 nm CMOS process and an off-chip antenna. The IC can support a maximum DC load of 100 μW for an incident acoustic intensity that is ~ 5% of the FDA diagnostic limit. This demonstrates the feasibility of providing further higher available DC power, potentially opening up new implant applications. The proposed hybrid bi-directional data link consists of ultrasonic downlink and RF uplink. Falling edge of the ultrasound input is detected as downlink data. The implant transmits an ultra-wideband (UWB) pulse sequence as uplink data, demonstrating capability of implementing an energy-efficient M-ary PPM transmitter in the future.

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