Glass transition temperature of nanoparticle-enhanced and environmentally stressed conductive adhesive materials for electronics assembly
Open Access
- 12 February 2019
- journal article
- research article
- Published by Springer Nature in Journal of Materials Science: Materials in Electronics
- Vol. 30 (5) , 4895-4907
Abstract
No abstract availableKeywords
This publication has 34 references indexed in Scilit:
- Glass transition temperature as an in situ cure index of electrically conductive adhesives in solar photovoltaic module interconnect assembliesSolar Energy Materials and Solar Cells, 2012
- Carbon nanotubes and silver flakes filled epoxy resin for new hybrid conductive adhesivesMicroelectronics Reliability, 2011
- Polymer nanocomposites based on functionalized carbon nanotubesProgress in Polymer Science, 2010
- Templating fabrication of polypyrrole nanorods/nanofibersSynthetic Metals, 2009
- Influence of thermal treatment on the glass transition temperature of thermosetting epoxy laminatePolymer Testing, 2009
- Effects of coupling agents on the properties of epoxy-based electrically conductive adhesivesInternational Journal of Adhesion and Adhesives, 2006
- A Reworkable Epoxy Resin for Isotropically Conductive AdhesiveIEEE Transactions on Advanced Packaging, 2004
- The durability of adhesive joints in the presence of waterInternational Journal of Adhesion and Adhesives, 1996
- Linear thermal expansion coefficients for an epoxy/glass matte-insulated solid cast transformerInternational Journal of Thermophysics, 1988
- Scanning electron microscopy of epoxy-glass laminates exposed to humid conditionsJournal of Materials Science, 1985