Failure-mechanism analysis for vertical high-power LEDs under external pressure
- 1 December 2015
- journal article
- Published by Elsevier in Microelectronics Reliability
- Vol. 55 (12) , 2671-2677
Abstract
No abstract availableKeywords
Funding Information
- National Natural Science Foundation of China (51405161, U1401249)
- Postdoctoral Science Foundation of China (2014M560659)
- National High-tech R&D Program of China (863 Program) (2013AA03A110)
This publication has 14 references indexed in Scilit:
- Assessment of Lumen Degradation and Remaining Life of Light-Emitting Diodes Using Physics-Based Indicators and Particle FilterJournal of Electronic Packaging, 2015
- Reconstruction and thermal performance analysis of die-bonding filling states for high-power light-emitting diode devicesApplied Thermal Engineering, 2014
- Comparison of effect of epoxy and silicone adhesive on the lifetime of plastic LED packageElectronic Materials Letters, 2013
- High power LED package with vertical structureMicroelectronics Reliability, 2012
- Light emitting diodes reliability reviewMicroelectronics Reliability, 2012
- Accelerated Life Testing in Epoxy Packaged High Luminosity Light Emitting DiodesJournal of Electronic Packaging, 2011
- Effects of Moist Environments on LED Module ReliabilityIEEE Transactions on Device and Materials Reliability, 2009
- Measurement and Prediction of Insertion Force for the Mosquito Fascicle Penetrating into Human SkinJournal of Bionic Engineering, 2009
- Accelerated Life Test of High Brightness Light Emitting DiodesIEEE Transactions on Device and Materials Reliability, 2008
- Insertion of microneedles into skin: measurement and prediction of insertion force and needle fracture forceJournal of Biomechanics, 2004