Microfabrication of high-temperature silicon devices using wafer bonding and deep reactive ion etching
Authors:
- A. MehraAMA. Mehra
- A.A. AyonAAA.A. Ayon
- I.A. WaitzIWI.A. Waitz
- M.A. SchmidtMSM.A. Schmidt
- 1 June 1999
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in Journal of Microelectromechanical Systems
- Vol. 8 (2) , 152-160
Abstract
No abstract availableThis publication has 13 references indexed in Scilit:
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