Numerical Simulation of Rapid Solidification Process for Micrometer Level Solder Ball Used in BGA Packaging
Authors:
- 1 July 2014
- journal article
- Published by Trans Tech Publications, Ltd. in Advanced Materials Research
- Vol. 981, 137-140
Abstract
We numerically simulated the containerless rapid solidification for micrometer level solder ball used in BGA packaging, based on prior models for heterogeneous droplet nucleation and non-equilibrium solidification, to predict the solidification microstructure of solder ball. Results of simulations for Sn-5mass%Pb solder ball produced under different conditions are discussed.Keywords
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