Microstructure and bonding strength of diffusion welding of Mo/Cu joints with Ni interlayer
Authors:
- Jian ZhangJZJian Zhang
- Qiang ShenQSQiang Shen
- Guoqiang LuoGLGuoqiang Luo
- Meijuan LiMLMeijuan Li
- Lianmeng ZhangLZLianmeng Zhang
- 1 August 2012
- journal article
- Published by Elsevier in Materials & Design (1980-2015)
- Vol. 39, 81-86
Abstract
No abstract availableKeywords
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