Numerical investigation and sensitivity analysis of manifold microchannel coolers
Authors:
- Lauren BotelerLBLauren Boteler
- Nicholas JankowskiNicholas Jankowski
- Patrick McCluskeyPMPatrick McCluskey
- Brian MorganBMBrian Morgan
- 1 December 2012
- journal article
- Published by Elsevier in International Journal of Heat and Mass Transfer
- Vol. 55 (25-26) , 7698-7708
Abstract
No abstract availableKeywords
This publication has 14 references indexed in Scilit:
- Efficiency of optimized bifurcating tree-like and parallel microchannel networks in the cooling of electronicsInternational Journal of Heat and Mass Transfer, 2009
- Experimental investigation of heat transfer performance for a novel microchannel heat sinkJournal of Micromechanics and Microengineering, 2008
- Highly efficient manifold microchannel heatsinkElectronics Letters, 2007
- Experimental and Numerical Study of a Stacked Microchannel Heat Sink for Liquid Cooling of Microelectronic DevicesJournal of Heat Transfer, 2007
- Direct Liquid Cooling of High Flux Micro and Nano Electronic ComponentsProceedings of the IEEE, 2006
- Heat transfer and pressure drop in fractal tree-like microchannel netsInternational Journal of Heat and Mass Transfer, 2002
- INVESTIGATIVE STUDY OF MANIFOLD MICROCHANNEL HEAT SINKS FOR ELECTRONIC COOLING DESIGNJournal of Electronics Manufacturing, 1999
- Analysis of two-layered micro-channel heat sink concept in electronic coolingInternational Journal of Heat and Mass Transfer, 1999
- Manifold microchannel heat sinks: isothermal analysisIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1997
- High-performance heat sinking for VLSIIEEE Electron Device Letters, 1981