Advanced Engineering Ceramics for Semiconductor Package Technology

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Abstract
Advanced engineering ceramic technology has very remarkable reputation in the high-tech fields such as semiconductor device manufacturing. ZTA (Zirconia Toughened Alumina), ruby and alumina is applied in the manufacturing of the capillaries that demonstrate high strength, fracture toughness and long life. The advantages of the new composite material over the standard ultra-fine grain high-density material have been proven in many applications especially for packages requiring less than 50μm capillary tip diameter. In this work, micro-structural evolution of ceramic composites and its correlation with important criteria in the selection of the suitable capillary material either ZTA composites or high-density ruby ceramics for a specific package applications will be discussed.

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