Simulation of Shape Evolution during Electrodeposition of Copper in the Presence of Additive
Authors:
- 1 January 2001
- journal article
- Published by The Electrochemical Society in Journal of the Electrochemical Society
- Vol. 148 (1) , C54-C58
Abstract
Shape evolution during electrodeposition of copper in microtrenches was studied numerically by a model which incorporates adaptive meshing capabilities. Filling of trenches with copper without creating a void was related to plating additives in solution. The shape-change behavior of this system resulting from variation of the feature’s aspect ratio, bulk composition, and level of additive components was investigated. The operating window of bath conditions for void-free electrodeposition was studied in the range of 0.25×10−40.25×10−4 to 10−4M10−4M bulk concentration of additive in a 0.25 M CuSO4+0.2MH2SO4CuSO4+0.2MH2SO4 plating solution and for aspect ratios (depth:width) from 0.5 to 4. The mathematical model includes fluid flow, transport by diffusion, migration and convection, multiple species, and reactions in complex geometries. © 2000 The Electrochemical Society. All rights reserved.Keywords
This publication has 19 references indexed in Scilit:
- Transport Phenomena That Control Electroplated Copper Filling of Submicron Vias and TrenchesJournal of the Electrochemical Society, 1999
- Pulse Reverse Copper Electrodeposition in High Aspect Ratio Trenches and ViasJournal of the Electrochemical Society, 1998
- Finite‐Difference Simulation of Multi‐Ion Electrochemical Systems Governed by Diffusion, Migration, and Convection: Implementation in Parallel‐Plate Electrochemical Reactor and Backward‐Facing Step GeometriesJournal of the Electrochemical Society, 1997
- Blocking Inhibitors in Cathodic Leveling: I. Theoretical AnalysisJournal of the Electrochemical Society, 1996
- Blocking Inhibitors in Cathodic Leveling: II. Experimental InvestigationJournal of the Electrochemical Society, 1996
- Current Distribution and Shape Change in Electrodeposition of Thin Films for Microelectronic Fabrication1993
- Dependent‐Variable Transformation for the Treatment of Diffusion, Migration, and Homogeneous Reactions: Application to a Corroding PitJournal of the Electrochemical Society, 1993
- Modeling Diffusion and Migration in Dilute Electrochemical Systems Using the Quasi‐Potential TransformationJournal of the Electrochemical Society, 1993
- Some fundamental aspects of levelling and brightening in metal electrodepositionJournal of Applied Electrochemistry, 1991
- The Effect of Inhibitor Transport on Leveling in ElectrodepositionJournal of the Electrochemical Society, 1991