Power cycling test and failure analysis of molded Intelligent Power IGBT Module under different temperature swing durations
Authors:
- U.M. ChoiUCU.M. Choi
- F. BlaabjergF. Blaabjerg
- S. JørgensenSJS. Jørgensen
- F. IannuzzoF. Iannuzzo
- H. WangHWH. Wang
- C. UhrenfeldtCUC. Uhrenfeldt
- S. Munk-NielsenSMS. Munk-Nielsen
- 1 September 2016
- journal article
- Published by Elsevier in Microelectronics Reliability
- Vol. 64, 403-408
Abstract
No abstract availableThis publication has 11 references indexed in Scilit:
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