Passivation of grain boundaries in polycrystalline silicon

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Abstract
Preferential diffusion of various gases down the grain boundaries in polycrystalline silicon is shown to promote significant changes in the density of defect states in these regions. A plasma of monatomic hydrogen provides a significant reduction in both the state density and the accompanying grain-boundary potential barrier while plasmas of oxygen, nitrogen, and sulfur hexafluoride are shown to increase this density of states. Boundaries passivated with hydrogen have as much as a factor of 1000 larger transconductance after treatment. Hydrogenated barriers are stable over long periods at 375 °C and essentially indefinitely at 23 °C. The results have important implications for the development of low-cost thin-film silicon photovoltaic devices.