Hydrogen annealing effect on DC and low-frequency noise characteristics in CMOS FinFETs

Authors:
  • YCYang-Kyu Choi
    Yang-Kyu Choi
  • DHDaewon Ha
    Daewon Ha
  • SBS. Balasubramanian
    S. Balasubramanian
  • TKTsu-Jae King
    Tsu-Jae King
  • JBJ. Bokor
    J. Bokor

Abstract
The hydrogen annealing process has been used to improve surface roughness of the Si-fin in CMOS FinFETs for the first time. Hydrogen annealing was performed after Si-fin etch and before gate oxidation. As a result, increased saturation current with a lowered threshold voltage and a decreased low-frequency noise level over the entire range of drain current have been attained. The low-frequency noise characteristics indicate that the oxide trap density is reduced by a factor of 3 due to annealing. These results suggest that hydrogen annealing is very effective for improving device performance and for attaining a high-quality surface of the etched Si-fin.

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