Copper deposition and thermal stability issues in copper-based metallization for ULSI technology
Authors:
- Jian LiJLJian Li
- Y. Shacham-DiamandYSY. Shacham-Diamand
- J.W. MayerJMJ.W. Mayer
- 1 December 1992
- journal article
- Published by Elsevier in Materials Science Reports
- Vol. 9 (1) , 1-51
Abstract
No abstract availableThis publication has 83 references indexed in Scilit:
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