Ultra-High Light Extraction Efficiency and Ultra-Thin Mini-LED Solution by Freeform Surface Chip Scale Package Array
Open Access
Abstract
In this study, we present a novel type of package, freeform-designed chip scale package (FDCSP), which has ultra-high light extraction efficiency and bat-wing light field. For the backlight application, mainstream solutions are chip-scale package (CSP) and surface-mount device package (SMD). Comparing with these two mainstream types of package, the light extraction efficiency of CSP, SMD, and FDCSP are 88%, 60%, and 96%, respectively. In addition to ultra-high light extraction efficiency, because of the 160-degree bat-wing light field, FDCSP could provide a thinner and low power consumption mini-LED solution with a smaller number of LEDs than CSP and SMD light source array.Keywords
Funding Information
- Ministry of Science and Technology, Taiwan (MOST 105-2221-E-009-112-MY3, 107-2221-E-009-113-MY3, and 107-2221-E-009-114-MY3)
- Strait Postdoctoral Foundation of Fujian Province of China (-)
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