Isothermal aging and shear creep behavior of a novel lead-free solder joint with small additions of Bi, Sb and Ni
Authors:
- Q.B. TaoQTQ.B. Tao
- L. BenabouLBL. Benabou
- T.A. Nguyen VanTVT.A. Nguyen Van
- H. Nguyen-XuanHNH. Nguyen-Xuan
- 1 June 2019
- journal article
- research article
- Published by Elsevier in Journal of Alloys and Compounds
- Vol. 789, 183-192
Abstract
No abstract availableKeywords
Funding Information
- National Foundation for Science and Technology Development
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