Microstructure design and dissolution behavior between 2024 Al/Sn with the ultrasonic-associated soldering
Authors:
- Yuanxing LiYLYuanxing Li
- Xuesong LengXLXuesong Leng
- Sheng ChengSCSheng Cheng
- Jiuchun YanJYJiuchun Yan
- 1 September 2012
- journal article
- Published by Elsevier in Materials & Design (1980-2015)
- Vol. 40, 427-432
Abstract
No abstract availableKeywords
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