Theoretical explorations of structure, mechanical properties, fracture toughness, electronic properties, and thermal conductivity of Ag-doped η′-Cu6Sn5
Authors:
- Ancang YangAYAncang Yang
- Yonghua DuanYDYonghua Duan
- Caiju LiCLCaiju Li
- Jianhong YiJYJianhong Yi
- Mingjun PengMPMingjun Peng
- 1 February 2022
- journal article
- research article
- Published by Elsevier in Intermetallics
- Vol. 141
Abstract
No abstract availableKeywords
This publication has 42 references indexed in Scilit:
- Nanomechanical characterization of Sn–Ag–Cu/Cu joints—Part 1: Young’s modulus, hardness and deformation mechanisms as a function of temperatureActa Materialia, 2013
- Microscopic theory of hardness and design of novel superhard crystalsInternational Journal of Refractory Metals and Hard Materials, 2012
- The effect of adding Ni and Ge microelements on the electromigration resistance of low-Ag based SnAgCu solderMicrosystem Technologies, 2012
- Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solderMaterials & Design (1980-2015), 2010
- Impurity and alloying effects on interfacial reaction layers in Pb-free solderingMaterials Science and Engineering: R: Reports, 2010
- Pressure tuning of the thermal conductivity of the layered muscovite crystalPhysical Review B, 2009
- Growth mechanisms of Cu3Sn on polycrystalline and single crystalline Cu substratesActa Materialia, 2009
- Phase stability and cohesive properties of Au–Sn intermetallics: A first-principles studyJournal of Materials Research, 2008
- Ab initiostudy of ductility in(, V, Cr)Physical Review B, 2007
- Interfacial reactions between lead-free solders and common base materialsMaterials Science and Engineering: R: Reports, 2005