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Advances in thermal management materials for electronic applications
Home
Publications
Advances in thermal management materials for electronic applications
Advances in thermal management materials for electronic applications
Author:
SJ
Sungho Jin
Sungho Jin
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1 June 1998
journal article
editorial
Published by
Springer Nature
in
JOM
Vol. 50
(6)
,
46
DOI:
10.1007/s11837-998-0127-7
Abstract
No abstract available
Keywords
DIAMOND FILM
THERMAL MANAGEMENT
ALUMINUM NITRIDE
ELECTRONIC PACKAGING
HEAT SPREADING
Cited
Cited by 13 articles
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