Efficient Transient Electro-Thermal Strongly Coupled Multiphysics Simulation via Equivalent Heat Source Based on the FDTD Method
- 22 April 2025
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Antennas and Wireless Propagation Letters
- Vol. 24 (8) , 2357-2361
Abstract
This paper presents a multiphysics simulation algorithm for electromagnetic-thermal strong coupling (ETSC) based on the finite-difference time-domain (FDTD) method. The proposed transient strong coupling multiphysics framework takes into account the effect of temperature on temperature-dependent parameters in both electrical and thermal properties, with synchronous iterations of the electromagnetic and temperature fields. For antennas operating in the RF frequency band, the thermal coupling considers not only Joule loss but also dielectric loss, investigating the impact of introducing dielectric loss. To address the multiscale time-domain issue in the multiphysics iterative process, a fast equivalent heat source algorithm is proposed, which significantly enhances computational efficiency while maintaining engineering-acceptable accuracy. To validate the accuracy of the method, numerical simulations were performed using a printed F antenna. The algorithm results showed a high degree of consistency with COMSOL software simulations. The rapid and accurate nature of the algorithm makes it an excellent simulation tool with significant applications in the fields of microwave circuits and radio frequency technology.Keywords
Funding Information
- Anhui Province Higher Education Science Research Project (2022AH050070)
- National Natural Science Foundation of China (62371002)
This publication has 17 references indexed in Scilit:
- A New Electro-Thermal Simulation Approach for Moving Electromagnetic Rail LaunchersIEEE Journal on Multiscale and Multiphysics Computational Techniques, 2024
- Electromagnetic-Circuital-Thermal-Mechanical Multiphysics Numerical Simulation Method for Microwave CircuitsIEEE Journal on Multiscale and Multiphysics Computational Techniques, 2024
- Multiphysics Computing of Challenging Antenna Arrays Under a Supercomputer FrameworkIEEE Journal on Multiscale and Multiphysics Computational Techniques, 2023
- Electromagnetic-Thermal Analysis With FDTD and Physics-Informed Neural NetworksIEEE Journal on Multiscale and Multiphysics Computational Techniques, 2023
- Electromagnetic-Thermal Modeling of Nonlinear Magnetic MaterialsIEEE Journal on Multiscale and Multiphysics Computational Techniques, 2022
- Massively Parallel Electromagnetic–Thermal Cosimulation of Large Antenna ArraysIEEE Antennas and Wireless Propagation Letters, 2020
- Temperature Compensation of an Air-Filled Stacked Ring ResonatorIEEE Microwave and Wireless Components Letters, 2020
- Electromagnetic-Thermal Analysis of Human Head Exposed to Cell Phones With the Consideration of Radiative CoolingIEEE Antennas and Wireless Propagation Letters, 2018
- Coupled Electrical-Thermal-Mechanical Simulation for the Reliability Analysis of Large-Scale 3-D InterconnectsIEEE Transactions on Components, Packaging and Manufacturing Technology, 2017
- Electro-Thermo-Mechanical Characterizations of Various Wire Bonding Interconnects Illuminated by an Electromagnetic PulseIEEE Transactions on Advanced Packaging, 2010