Effect of Sn Orientation on Electromigration Failure in CuSn Solders
- 26 July 2024
- journal article
- research article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 53 (10) , 6424-6431
Abstract
No abstract availableKeywords
Funding Information
- Semiconductor Research Corporation (2878.009)
This publication has 31 references indexed in Scilit:
- Mechanical Failure of Cu-Sn Solder JointsJournal of Electronic Materials, 2021
- On the interfacial phase growth and vacancy evolution during accelerated electromigration in Cu/Sn/Cu microjointsActa Materialia, 2018
- Identification of whisker grain in Sn coatings by analyzing crystallographic micro-texture using electron back-scatter diffractionActa Materialia, 2017
- Coupled diffusion-deformation multiphase field model for elastoplastic materials applied to the growth of Cu6Sn5Acta Materialia, 2016
- Phase-field simulations of intermetallic compound evolution in Cu/Sn solder joints under electromigrationActa Materialia, 2013
- Concurrent nucleation, formation and growth of two intermetallic compounds (Cu6Sn5 and Cu3Sn) during the early stages of lead-free solderingActa Materialia, 2012
- A quantitative and thermodynamically consistent phase-field interpolation function for multi-phase systemsActa Materialia, 2011
- In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressingActa Materialia, 2005
- Phase field simulations of intermetallic compound growth during soldering reactionsJournal of Electronic Materials, 2004
- A numerical method for predicting intermetallic layer thickness developed during the formation of solder jointsJournal of Electronic Materials, 1996